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IR2104 (S) & (PbF)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are
measured under board mounted and still air conditions.
Symbol
V B
V S
V HO
V CC
V LO
V IN
dV s /dt
Definition
High side floating absolute voltage
High side floating supply offset voltage
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
Logic input voltage (IN & SD )
Allowable offset supply voltage transient
Min.
-0.3
V B - 25
V S - 0.3
-0.3
-0.3
-0.3
—
Max.
625
V B + 0.3
V B + 0.3
25
V CC + 0.3
V CC + 0.3
50
Units
V
V/ns
P D
Rth JA
Package power dissipation @ T A ≤ +25 ° C
Thermal resistance, junction to ambient
(8 lead PDIP)
(8 lead SOIC)
(8 lead PDIP)
—
—
—
1.0
0.625
125
W
° C/W
(8 lead SOIC)
—
200
T J
Junction temperature
—
150
T S
T L
Storage temperature
Lead temperature (soldering, 10 seconds)
-55
—
150
300
° C
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the
recommended conditions. The V S offset rating is tested with all supplies biased at 15V differential.
Symbol
V B
V S
V HO
V CC
V LO
V IN
T A
Definition
High side floating supply absolute voltage
High side floating supply offset voltage
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
Logic input voltage (IN & SD )
Ambient temperature
Min.
V S + 10
Note 1
V S
10
0
0
-40
Max.
V S + 20
600
V B
20
V CC
V CC
125
Units
V
° C
Note 1: Logic operational for V S of -5 to +600V. Logic state held for V S of -5V to -V BS . (Please refer to the Design Tip
DT97-3 for more details).
2
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